EP5
THIERRY BELMONTE
Prof. Thierry Belmonte and his people have visited from March 9th-12th, 2015 the group of Prof. Czarnetzki. Prof. Belmonte (Institut Jean Lamour, Nancy, France) is investigating pulsed discharges in liquids (liquid nitrogen, water, alcohols) for generation of variety of nanoparticles. Because the jitter of the discharge ignition time and the pulse-to-pulse differences among the formed microdischarges are large, it is very difficult to obtain reliable time-resolved information about discharge performance. An ideal diagnostics for such discharges is a use of streak camera. This camera has been provided to plasma researchers in Bochum by Germen Science Foundation (DFG) in frame of Research Unit "Physics of Microplasmas" (FOR 1123) and has been now successfully applied to the discharge of Prof. Belmonte with the assistance of AvH stipend Dr. Emile Carbone and PhD student Patrick Böhm. These activities are suported by a Leverhulme Trust lnternational Network Collaboration "Materials processing by atmospheric pressure plasmas for energy applications", initiated by Dr. Davide Mariotti (University of Ulster, Jordanstown, Northern Ireland) and includes also Jun.-Prof. Jan Benedikt (Ruhr-University Bochum) and Dr. Vladimir Švrček (National Inst. of Advanced Industrial Sci. and Techn. (AIST), Tsukuba, Japan).
TET
DR. ZOLTAN DONKO UND DR. PETER HARTMANN
From March 2 to 6, 2015, Dr. Zoltan Donko and Dr. Peter Hartmann from the Wigner Research Center for Physics of the Hungarian Academy of Sciences were guests at the Chair of Theoretical Electrical Engineering in Bochum. This provided many opportunities for intensive collaboration and exchange on the mechanism of electron heating in capacitively coupled low-temperature plasmas. The stay was funded by the German Research Foundation in the framework of the Collaborative Research Center Transregio 87.
EP2
PROF. GOTTLIEB OEHRLEIN
Prof. Gottlieb S. Oehrlein will spend part of his sabbatical with Prof. Achim von Keudell (Experimental Physics II) in April 2015. He is coming from the Department of Materials Science and Engineering, Institute for Research in Electronics and Applied Physics at the University of Maryland, USA and will give a talk on "Low temperature plasma research at the university of Maryland" on 4/20/2015 at 9:15 am (seminar room EP2, NB 5). In this context, he will also offer a small crash course on "A brief overview of materials processing using low temperature plasma" on 4/27/2015, 13:00-17:00.
EP2
REMI DUSSART UND VALENTIN FELIX
From March 16-18, 2015, Prof. Dr. Remi Dussart and PhD student Valentin Felix from GREMI are guests of Dr. Volker Schulz-von der Gathen and PhD student Judith Golda. Valentin will stay until March 20. Pascal Vogel, who was at GREMI for six months via Erasmus and developed the arrays with Valentin as part of a project with Remi Dussart, will also be there and is currently being tested.
TET
DR. SVEN ZIMMERMANN
On March 24, 2015, Dr. Sven Zimmermann from the TU Chemnitz and the Fraunhofer Institute for Electronic Nano Systems, respectively, will give a lecture in ID 04/401 as part of the Faculty Colloquium (Eletrotechnology and Information Technology). The title is "28 nm Technologies and Beyond: Challenges of Plasma Processing". Interested parties are cordially invited.
Dr. Sven Zimmermann is a guest of PD Dr. Thomas Mussenbrock (TET).
Kolloquiumsvortrag Sven Zimmermann
ABSTRACT: Plasma patterning processes play a key role in modern ULSI device fabrication. With further
scaling of device dimensions plasma process characteristics become more and more the
limiting factor in pattern minimization not least due parasitic effects caused by different plasma properties. Such effects are notching, footing and source/drain destruction during high-k/metal-gate patterning as well as the most critical sidewall damage while etching trenches an
d vias in back-end of line technologies for ultra low-k dielectrics. Finally the charge
damage of thin gate oxides during plasma processing results in decreased reliability and function
ality of completed devices. The lecture overviews typical challenges during plasma patterning processes in 28 nm and 22 nm technology nodes by means of today’s back-end of line integration schemes. Different plasma diagnostic methods give an insight into physical and chemical conditions
of different etch chambers and their influence on process results and damaging behavior.
Finally a plasma assisted chemical repair process for etch damaged ultra low-k sidewalls will
be introduced. This process bases on the fragmentation of different organosilicon molecules using in a downstream plasma chamber, whereby significantly enhanced repair efficiency can be achieved.